Concepedia
Scripta Metallurgica et Materialia · 1995 · 40 citations · 7 references
EngineeringMaterials EngineeringMaterials ScienceMetallurgyAlloysGrain Structure FormationMetalsMicrostructure ControlFiller MetalsInterfacial MicrostructureMicrostructure
7
The wetting of alumina by copper alloyed with titanium and other elements
M. G. Nicholas, T. M. Valentine, M. J. Waite · Journal of Materials Science · 1980 · 142 citations
Natural Sciences, Materials Engineering, Materials Science +12
Interactions of thin Ti films with Si, SiO2, Si3N4, and SiO<i>x</i>N<i>y</i> under rapid thermal annealing
A. E. Morgan, E. K. Broadbent, K. N. Ritz et al. · Journal of Applied Physics · 1988 · 123 citations
Natural Sciences, Materials Engineering, Materials Science +17
Bonding Mechanisms in Silicon Nitride Brazing
Ronald E. Loehman, Antoni P. Tomsia, Joseph A. Pask et al. · Journal of the American Ceramic Society · 1990 · 79 citations
Thermodynamics of Ti in Ag-Cu alloys
Jong Jin Pak, M.L. Santella, R. J. Fruehan · Metallurgical Transactions B · 1990 · 52 citations
Joining of Si3N4 using Ag57Cu38Ti5 brazing filler metal
A. P. Xian, Z. -Y. · Journal of Materials Science · 1990 · 36 citations
Engineering, Materials Engineering, Materials Science +10