Novel diamond conditioner dressing characteristics of CMP polishing pad

Principles and applications of tribology

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Pad conditioning in chemical mechanical polishing

Bill Hooper, Greg Byrne, S Galligan · Journal of Materials Processing Technology · 2002 · 125 citations

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Wear phenomena in chemical mechanical polishing

Hong Liang, F. B. Kaufman, Rubén Sevilla et al. · Wear · 1997 · 109 citations

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Optical interferometry for surface measurements of CMP pads

David J. Stein, Dale L. Hetherington, Tom Stout · Journal of Electronic Materials · 1996 · 88 citations

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