Journal of Applied Polymer Science · 1984 · 154 citations · 0 references
Natural SciencesMaterials EngineeringMaterials SciencePolymer ChemistryPolymer EngineeringReaction EngineeringNanocompositesPolymerization ExothermPolymerization KineticsThermosetsThermosetting PolymersCuringCuring KineticsEpoxy CuringEpoxy ResinsIsothermal KineticsOverall Reaction OrderReaction Rate ModelingThermoset Curing Kinetics
An analysis of the cure kinetics of three different formulations composed of tetraglycidyl 4,4′-diaminodiphenyl methane (TGDDM) epoxy resin and diaminodiphenyl sulfone (DDS) was performed. A series of isothermal tests was run, and the experimentally obtained results were checked against the proposed kinetic model. An autocatalyzed mechanism with the overall reaction order of 2 was found to adequately describe the cure kinetics. An increase in reaction rate was observed at higher temperature and higher DDS concentration. For a given formulation, the extent of reaction corresponding to the maximum reaction rate was independent of temperature. A secondary exotherm was detected, particularly in formulations with low DDS concentration, at approximately 40% conversion. At that point, the rate of primary amine–epoxide reaction decreases, and other reactions dominate the curing process. Such a mechanism is likely to cause a formation of an inhomogeneous thermoset morphology.