Publication | Closed Access
Reliability of ultrathin (<2 nm) oxides on strained SiGe heterolayers
75
Citations
18
References
2002
Year
Materials EngineeringMaterials ScienceElectrical EngineeringEngineeringRapid Thermal OxidationNanoelectronicsStrained Sige HeterolayersStress-induced Leakage CurrentApplied PhysicsOxide ElectronicsThermal OxidesSemiconductor MaterialMultilayer HeterostructuresSemiconductor Device FabricationNitrogen IncorporationMicroelectronicsSilicon On Insulator
The influence of nitrogen incorporation on the reliability of ultrathin (<2 nm) rapid thermal oxides grown on strained Si/SiGe/Si heterolayers has been investigated. It is shown that rapid thermal oxidation using N2O followed by N2-annealing results in improved electrical properties and reliability in terms of stress induced leakage current, low bulk trap density, trap generation rate and high lifetime.
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