Electrical characterization of copper interconnects with end-of-roadmap feature sizes - Concepedia

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Electrical characterization of copper interconnects with end-of-roadmap feature sizes

42

Citations

4

References

2003

Year

G. Schindler, G. Steinlesberger, M. Engelhardt, W. Steinhögl

Solid-State Electronics

Electrical EngineeringElectromigration TechniqueEngineeringNanoelectronicsElectrical CharacterizationElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)Electrical Insulation

References

	Year	Citations

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