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A>400 GHz f/sub max/ transferred-substrate heterojunction bipolar transistor IC technology
67
Citations
6
References
1998
Year
μM×25 μM EmitterElectrical EngineeringMillimeter Wave TechnologyEngineeringRf SemiconductorHigh-frequency DeviceTransistor Heat-sinkingElectronic EngineeringApplied PhysicsTransferred-substrate Fabrication ProcessMicroelectronicsMicrowave EngineeringElectronic Circuit
We report transferred-substrate AlInAs/GaInAs bipolar transistors. A device having a 0.6 μm×25 μm emitter and a 0.8 μm×29 μm collector exhibited f/sub /spl tau//=134 GHz and f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> >400 GHz. A device with a 0.6 μm×25 μm emitter and a 1.8 μm×29 μm collector exhibited 400 GHz f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> 164 GHz f/sub /spl tau//. The improvement in f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> over previous transferred-substrate HBT's is due to improved base Ohmic contacts, narrower emitter-base and collector-base junction areas, and slightly reduced transit times. The transferred-substrate fabrication process provides electroplated gold thermal vias for transistor heat-sinking and a microstrip wiring environment on a low dielectric constant polymer substrate.
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