Publication | Open Access

Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

Materials ScienceMaterials EngineeringAluminium NitrideEngineeringDiffusion ResistanceCorrosionSurface RoughnessDiffusion BondingSurface ScienceApplied PhysicsAtomistic InvestigationMetallurgical InteractionElemental MetalInterface PropertyMicrostructure