Microforming process for embossing of LTCC tapes

Abstract

Embossing of low-temperature cofired ceramics (LTCC) enables the fine patterning of these multilayer materials in the green state and thus allows the fabrication of smart ceramic microsystems even for moderate quantities or prototypes. To understand the embossing process, mechanical properties such as the viscoelastic modulus, yield strain and densification are investigated for commercially available LTCC tapes. The forming and shrinkage behaviour are compared for large cavities as well as for fine patterns. The results are discussed and a comprehensive explanation of the forming mechanism is worked out. Relevant material properties are identified and the microforming of different tapes is explained under consideration of their mechanical properties. This paper therefore gives an essential guide to understanding the main forming influences and failures for LTCC tapes.