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Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films

Materials EngineeringMaterials ScienceEngineeringMetallurgical SystemCorrosionApplied PhysicsIsothermal AgingMetallurgical InteractionMetallurgical ProcessReaction FilmsElectronic PackagingMetal WhiskersMicrostructure