Physical vapor deposition of chromium and titanium nitrides by the hollow cathode discharge process

Fundamentals of Ion Plating

D.M. Mattox · Journal of Vacuum Science and Technology · 1973 · 199 citations

Engineering, Chemical Deposition, Ion Process +19

Highly Ionized Hollow Cathode Discharge

L. M. Lidsky, S. D. Rothleder, David J. Rose et al. · Journal of Applied Physics · 1962 · 131 citations

Electrical Engineering, Plasma Electronics, Engineering +14

The Effect of Substrate Temperature on the Structure of Titanium Carbide Deposited by Activated Reactive Evaporation

AC Raghuram, R.F. Bunshah · Journal of Vacuum Science and Technology · 1972 · 99 citations

High Temperature Deposits, Engineering, Preferred Orientation +18

Thin film formation of In2O3, TiN, and TaN by rf reactive ion plating

Yoichi Murayama · Journal of Vacuum Science and Technology · 1975 · 54 citations

Materials Science, Materials Engineering, Thin Film Formation +12

High Rate Ion Production for Vacuum Deposition

John R. Morley, Hugh R. Smith · Journal of Vacuum Science and Technology · 1972 · 33 citations

Materials Science, Evaporation Rate, Electrical Engineering +15