IEEE Microwave and Wireless Components Letters · 2013 · 30 citations · 11 references
EngineeringElectrical EngineeringAnalog ElectronicsMicroelectronicsMicrowave EngineeringCmos Circuit DesignIntegrated Circuit DesignLow-noise Circuit DesignMicrowave AmplifiersMicrowave Integrated CircuitsRadio-frequency Integrated CircuitsCircuit TopologyCmos Microwave AmplifiersDistributed AmplifiersLow-noise AmplifiersNoise FigureNoise Figure AnalysisNoise Figure MeasurementPower Consumption
This letter proposes a wideband switchless bi-directional distributed amplifier in a commercial 0.13 μm CMOS technology, which realizes multi-octave bandwidth with high gain and low noise figure using distributed amplifier technique and cascode-amplifier pair. The measured gain is over 10 dB and measured noise figure is 3.2-6.5 dB. The input and output return losses are better than 9 dB at 3-20 GHz. The measured output P1dB and OIP3 are larger than 8 dBm and 17 dBm at 4-15 GHz. The chip size is 0.96 × 0.85 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> including pads. The proposed switchless bi-directional amplifier has almost the same chip size compared to the conventional uni-directional distributed amplifier. The dc power consumption is around 68 mW at 1.5 V supply voltage. Nearly identical RF performances are achieved in the forward and the backward operations due to the symmetric circuit topology and layout.
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Dong‐Woo Kang, Jeong‐Geun Kim, Byung‐Wook Min et al. · IEEE Transactions on Microwave Theory and Techniques · 2009 · 156 citations
GaN single-chip transceiver frontend MMIC for X-band applications
S. Masuda, Masao Yamada, Youichi Kamada et al. · 2012 · 61 citations