Publication | Closed Access
Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure
60
Citations
11
References
2003
Year
Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Applied PhysicsCombination StructureElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)
| Year | Citations | |
|---|---|---|
Page 1
Page 1