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Comparison of surface roughness of polished silicon wafers measured by light scattering topography, soft-x-ray scattering, and atomic-force microscopy
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1995
Year
EngineeringPolished Silicon WafersMicroscopyMechanical EngineeringSurface IntegrityRms RoughnessSurface ProcessingWafer Scale ProcessingSoft-x-ray ScatteringSurface PolishingMaterials ScienceSurface RoughnessSurface FinishingSurface FinishMicroelectronicsMicrostructureSurface CharacterizationMicrofabricationSurface AnalysisSurface ScienceApplied PhysicsMaterials CharacterizationSurface EngineeringDifferent StagesRoughness Exponent
The surface roughness of silicon wafers after different stages of chemomechanical polishing was investigated by light scattering topography, soft-x-ray scattering, and atomic-force microscopy. Quantitative values of the rms roughness, the lateral correlation length, and the roughness exponent are extracted. The results suggest deviations from the ‘‘ideal’’ polishing process at large length scales.