Publication | Open Access
Monolithic integration of a silica AWG and Ge photodiodes on Si photonic platform for one-chip WDM receiver
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Citations
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References
2012
Year
PhotonicsPhotonic SensorFlip-chip Bonding TechnologyMultichannel TransimpedanceEngineeringIntegrated PhotonicsGe PhotodiodesAwg-pd DeviceDevice IntegrationSilica AwgNanophotonicsIntegrated CircuitsOne-chip Wdm ReceiverPhotonic Integrated CircuitMicroelectronicsPhotonic DeviceOptoelectronicsSilicon Photonics
On the silicon (Si) photonic platform, we monolithically integrated a silica-based arrayed-waveguide grating (AWG) and germanium (Ge) photodiodes (PDs) using low-temperature fabrication technology. We confirmed demultiplexing by the AWG, optical-electrical signal conversion by Ge PDs, and high-speed signal detection at all channels. In addition, we mounted a multichannel transimpedance amplifier/limiting amplifier (TIA/LA) circuit on the fabricated AWG-PD device using flip-chip bonding technology. The results show the promising potential of our Si photonic platform as a photonics-electronics convergence.
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