Nanoindentation of lead-free solders in microelectronic packaging - Concepedia

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Nanoindentation of lead-free solders in microelectronic packaging

49

Citations

18

References

2006

Year

C.Z. Liu, Jie Chen

Materials Science and Engineering A

Materials ScienceEngineeringAdvanced Packaging (Semiconductors)NanomaterialsNanotechnologyMicrofabricationFabrication TechniqueApplied PhysicsChip AttachmentElectronic PackagingLead-free Solders

References

	Year	Citations

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