Solution hardened platinum alloy flexure materials for improved performance and reliability of MEMS devices

Abstract

Solution hardened platinum alloys are presented for use as a MEMS flexure material. Two Pt alloys are discussed in this work; Pt alloyed with 15% Rh and 6% Ru (known as Alloy 851) and an alloy of Pt with 10% Ir. These alloys do not require protective masking, resulting in fewer fabrication steps because the alloys can be exposed to fluorine, chlorine and oxygen plasmas as well as wet chemical etches without damage. These alloys combine many desirable properties such as biocompatibility, extreme corrosion resistance, good electrical/thermal conductivity, high Young's modulus, high yield strength [1], low hysteresis and fatigue, and they are non-ferromagnetic. Compositional profiles for the sputtered films are described, as well as stress control during deposition. Nanoindentation experiments were performed to measure mechanical properties. The mechanical performance of these Pt alloy flexures as supports for rotating micromirror structures is described.