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Effective cleaning process and its influence on surface roughness in anodic bonding for semiconductor device packaging

Materials ScienceElectrical EngineeringWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)MicrofabricationSurface RoughnessSurface ScienceApplied PhysicsChip AttachmentSemiconductor Device PackagingEffective Cleaning ProcessElectronic PackagingMicroelectronicsSurface Processing