Publication | Closed Access

Process technology for the modular integration of CMOS and polysilicon microstructures

Materials ScienceWafer Scale ProcessingModular IntegrationEngineeringDevice IntegrationMicrofabricationAdvanced Packaging (Semiconductors)Polysilicon MicrostructuresMechanical EngineeringComputer EngineeringElectronic PackagingSilicon On InsulatorMicroelectronicsMicrostructureProcess Technology