Microstructural development in NiAl/Ni-Si-B/Ni transient liquid phase bonds

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

Engineering, Materials Engineering, Materials Science +11

High temperature aluminides and intermetallics

V. R. Parameswaran · JOM · 1992 · 291 citations

Natural Sciences, Materials Engineering, Materials Science +12

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

Engineering, Materials Engineering, Materials Science +13

Development of intermetallic materials for aerospace systems

Dennis M. Dimiduk, D.B. Miracle, C.H. Ward · Materials Science and Technology · 1992 · 145 citations

Natural Sciences, Materials Engineering, Materials Science +13

Microstructural development in transient liquid-phase bonding

William F. Gale, E. R. Wallach · Metallurgical Transactions A · 1991 · 143 citations

Natural Sciences, Materials Engineering, Materials Science +14