Publication | Closed Access
Electrical insulation properties of sputter‐deposited SiO<sub>2</sub>, Si<sub>3</sub>N<sub>4</sub> and Al<sub>2</sub>O<sub>3</sub> films at room temperature and 400 °C
41
Citations
10
References
2009
Year
Materials EngineeringMaterials ScienceElectrical EngineeringRoom TemperatureHigh Temperature MaterialsSio 2Breakdown Field StrengthEngineeringElectrical Insulation PropertiesOxide ElectronicsApplied PhysicsTime-dependent Dielectric BreakdownSemiconductor MaterialThin Film Process TechnologyThin FilmsChemical Vapor DepositionThin Film ProcessingElectrical Insulation
Abstract In this paper the breakdown field strength and resistivity of sputter‐deposited Al 2 O 3 , SiO 2 and Si 3 N 4 layers are investigated in the temperature range between room temperature and 400 °C. All the investigated layers showed excellent insulation properties, even at elevated sample temperature. One example of industrial application is the deposition of electrical insulation layers onto the membranes of pressure sensors using cluster type sputter equipment
| Year | Citations | |
|---|---|---|
Page 1
Page 1