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A 130.7mm<sup>2</sup> 2-layer 32Gb ReRAM memory device in 24nm technology

116

Citations

4

References

2013

Year

Abstract

ReRAM has been considered as one of the potential technologies for the next-generation nonvolatile memory, given its fast access speed, high reliability, and multi-level capability. Multiple-layered architectures have been used for several megabit test-chips and memory macros [1-3]. This paper presents a MeOx-based 32Gb ReRAM test chip developed in 24nm technology.

References

YearCitations

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