Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications - Concepedia

Concepedia

Publication | Closed Access

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

22

Citations

35

References

2015

Year

Wei Mu, Shuangxi Sun, Di Jiang, Yifeng Fu, Michael Edwards, Yong Zhang, Kjell Jeppson, Johan Liu

Journal of Electronic Materials

Materials ScienceCarbon Nanotube BundlesEngineeringCarbon-based MaterialNanomaterialsApplied PhysicsPrinted ElectronicsElectronic PackagingCarbon Nanotubes

References

	Year	Citations

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