Heat dissipating structure design of an inverter with direct-cooling IGBT module for EV

Abstract

In this paper, we tested the heat dissipating performance of a self-developed 2 in 1 direct cooling IGBT module and contrasted with the traditional indirect cooling module, and a simulation model for the module was verified accurate. The experiment results show that entire thermal resistance of the direct cooling module is reduced up to 33%, meanwhile the temperature field distribution is more uniform. Then we conducted the heat dissipation structure design for a high power density inverter, and got a satisfactory result using the simulation model. At last, we tested the thermal resistance of direct cooling IGBT module in the inverter.