Publication | Closed Access
Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method
28
Citations
21
References
2011
Year
Materials EngineeringMaterials ScienceEngineeringCorrosionSurface ScienceMechanical EngineeringAnodic BondingActivated Tin SolderAmorphous MetalSolidificationLiquid StateMicrostructureCladding (Metalworking)
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