Publication | Closed Access
Recent Progress in Silicon Photonics R&D and Manufacturing on 300mm Wafer Platform
46
Citations
9
References
2015
Year
Soi WafersEngineeringDevice IntegrationSilicon Photonics PlatformWafer Scale ProcessingAdvanced Packaging (Semiconductors)Recent ProgressPhotonic Integrated CircuitElectronic PackagingPhotonicsElectrical EngineeringSilicon Photonics ROptical InterconnectsComputer EngineeringSemiconductor Device FabricationWafer PlatformMicroelectronicsPhotonic DeviceSilicon PhotonicsApplied PhysicsLow Cost PackagingOptoelectronics
A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.
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