Optical Fiber Communication Conference · 2015 · 46 citations · 9 references
EngineeringElectrical EngineeringManufacturing EngineeringMicroelectronicsPhotonicsSemiconductor DevicesChip PackagingIntegrated Circuit DesignIntegrated Circuit FabricationIntegrated PhotonicsPhotonic Integrated CircuitsSilicon PhotonicsChip-to-chip Optical InterconnectsCmos-compatible PhotonicsDevice FabricationIntegrated Photonic DevicesOptical PackagingPhotonics-to-electronics IntegrationSilicon Photonics IntegrationSilicon Wafers
A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.
9