International Journal of Fatigue · 2009 · 55 citations · 9 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMicroelectronicsSemiconductor DevicesDevice ReliabilityFailure TheoriesFatigueSemiconductor ReliabilityThermal Properties Of MaterialsThermal StressesDevice DegradationThermal FatigueThermal Fatigue ResistanceThermal ReliabilityThermomechanical Fatigue
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Slightly curved or kinked cracks
B. Cotterell, J. R. Rice · International Journal of Fracture · 1980 · 1.9K citations
Solution of Crack Problems: The Distributed Dislocation Technique
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