Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper - Concepedia

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Intermetallic compound layer growth by solid state reactions between 58Bi-42Sn solder and copper

79

Citations

6

References

1995

Year

Paul T. Vianco, A. C. Kilgo, R.J. Grant

Journal of Electronic Materials

Materials EngineeringMaterials ScienceSolid State ReactionsEngineeringSuperalloyCorrosionCrystal Growth TechnologyApplied PhysicsAlloy DesignMetallurgical InteractionSolid-state Chemistry58Bi-42sn SolderMicrostructure

References

	Year	Citations

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