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Hydrogen bonding configurations in silicon nitride films prepared by plasma-enhanced deposition
70
Citations
11
References
1985
Year
EngineeringOptoelectronic DevicesChemistryPlasma-enhanced DepositionSilicon On InsulatorPlasma ProcessingSemiconductorsThin Film ProcessingMaterials ScienceCrystalline DefectsSemiconductor Device FabricationHydrogenHydrogen BondingReference FilmPlasma EtchingElectronic MaterialsSurface ScienceApplied PhysicsAmorphous SiliconThin FilmsChemical Vapor DepositionSilicon Nitride Films
Hydrogen chemical bonding configurations in amorphous silicon nitride films prepared by plasma-enhanced chemical vapor deposition are determined for the first time. This is accomplished by measuring the difference spectra between the absorption spectrum of an annealed or a hydrogen implanted film and that of a reference film, mostly as-grown film. Three- and two-bonding configurations for Si-hydrogen and N-hydrogen bonds are separated and assigned to Si-H(2120 cm−1), Si-H2 and/or (Si-H2)n chains (2180 cm−1), Si-H3(2255 cm−1), N-H(3320 cm−1), and N-H2(3280 and 3345 cm−1), respectively. Si-H2 bonds are the most thermally stable and N-H2 bonds are more thermally stable than N-H bonds. It is found that N-H bonds form the hydrogen bonding in the films.
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