Development of underfilling and encapsulation for deep-ultraviolet LEDs

Abstract

The currently available resins for underfilling and encapsulation are limited to wavelengths longer than approximately 330 nm because almost all resins are decomposed by deep-ultraviolet light. Fluorine resins are possible materials for underfilling and encapsulation in deep-ultraviolet LEDs, and we have investigated methods of underfilling and encapsulation using such resins. Also, their durability at wavelengths of 265 and 285 nm has been studied from the photochemical viewpoint, and we propose a stable amorphous fluorine resin that is optically isotropic. Also, a trial of encapsulation using the resin has been made.