Publication | Closed Access
Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines
15
Citations
22
References
2008
Year
Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringInterconnect (Integrated Circuits)Applied PhysicsElectronic PackagingMicroelectronicsElectrochemical InterfaceIncorporated Non-metallic ImpuritiesElectrochemistryElectrical Insulation
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