Concepedia

Publication | Closed Access

Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling

DOI

16

Citations

14

References

2004

Year

Chi‐Hui Chien, Y. C. Chen, Chi-Chang Hsieh, Yii-Tay Chiou, Yii-Der Wu, T. -P. Chen
Experimental Mechanics

References

YearCitations

Page 1