Publication | Open Access
Ultrathin Silicon Circuits With Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper
401
Citations
33
References
2009
Year
EngineeringMechanical EngineeringUnconventional SubstratesMechanical CyclingStrain‐isolation LayersIntegrated CircuitsSilicon On InsulatorFlexible SensorTheoretical AnalysisElectronic DevicesCircuit SystemSoft RoboticsNanoelectronicsPrinted ElectronicsMesh LayoutsElectronic PackagingMaterials ScienceElectrical EngineeringUltrathin Silicon CircuitsWearable ElectronicsSemiconductor Device FabricationMicroelectronicsElectronic MaterialsFlexible ElectronicsMicrofabricationApplied PhysicsNano Electro Mechanical System
We present various stretchable high-performance CMOS circuit demonstrations on unconventional substrates, such as fabric, vinyl, leather, and paper. Electronics on such substrates, especially paper, open up new and important application possibilities for electronics. Theoretical analysis reveals the underlying mechanics of these systems; electrical tests under mechanical cycling demonstrate the robustness of the designs.
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