Publication | Closed Access
Aluminum nitride for heatspreading in RF IC’s
36
Citations
23
References
2008
Year
Materials EngineeringAluminium NitrideElectrical EngineeringAluminum NitrideEngineeringRf SemiconductorApplied PhysicsElectronic PackagingHeat TransferThermal EngineeringThermal Property
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