Publication | Closed Access
Electromigration in Line-Type Cu/Sn-Bi/Cu Solder Joints
59
Citations
20
References
2008
Year
Materials ScienceMaterials EngineeringElectrical EngineeringElectromigration TechniqueEngineeringChip AttachmentElectronic PackagingMicroelectronicsElectrochemistry
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