Publication | Closed Access
Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints
15
Citations
27
References
2006
Year
Materials ScienceMaterials EngineeringFriction WeldingEngineeringCorrosionIntermetallic Compound FormationApplied PhysicsMetallurgical InteractionMetallurgical ProcessElectronic PackagingMetallurgical SystemMicrostructureMetal Processing
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