Growth of electrolytic copper dendrites and their adhesion to an epoxy resin

Printed circuit fabrication

Metal Finishing · 1999 · 84 citations

Handbook of Tape Automated Bonding

John H. Lau, William T. Chen · Journal of Electronic Packaging · 1992 · 60 citations

Engineering, Manufacturing Engineering, Instrumentation +13

Enhanced Cu-Teflon adhesion by presputtering treatment: Effect of surface morphology changes

Chin‐An Chang · Applied Physics Letters · 1987 · 44 citations

Engineering, Materials Engineering, Materials Science +17

Surface Pretreatment of Zinc and its Adhesion to Epoxy Resins

P.J. Hine, Suhayla El Muddarris, D. E. Packha · The Journal of Adhesion · 1984 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +15

Tackiness of GR-S and Other Elastomers

Warren F. Busse, J. M. Lambert, R. B. Verdery · Journal of Applied Physics · 1946 · 25 citations

Natural Sciences, Materials Engineering, Materials Science +8