Publication | Closed Access
Microstructure effect on EM-induced copper interconnect degradation: Experiment and simulation
20
Citations
15
References
2005
Year
Materials ScienceMaterials EngineeringElectrical EngineeringMicrostructure EffectEngineeringAdvanced Packaging (Semiconductors)Electromigration TechniqueCorrosionApplied PhysicsMetallurgical InteractionElectronic PackagingMicroelectronicsMicrostructureElectrical Insulation
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