Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 1: Young’s modulus, hardness and deformation mechanisms as a function of temperature

Interfacial reactions between lead-free solders and common base materials

Tomi Laurila, Vesa Vuorinen, J.K. Kivilahti · Materials Science and Engineering R Reports · 2005 · 1.1K citations

Natural Sciences, Materials Engineering, Materials Science +12

Critical review of analysis and interpretation of nanoindentation test data

A. C. Fischer-Cripps · Surface and Coatings Technology · 2005 · 734 citations

Natural Sciences, Materials Engineering, Materials Science +14

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

Quantitative insight into dislocation nucleation from high-temperature nanoindentation experiments

Christopher A. Schuh, Jeremy K. Mason, Alan C. Lund · Nature Materials · 2005 · 448 citations

Natural Sciences, Materials Engineering, Materials Science +16

Pop-in effect as homogeneous nucleation of dislocations during nanoindentation

Dominik Lorenz, A. Zeckzer, Uwe Hilpert et al. · Physical review. B, Condensed matter · 2003 · 348 citations

Natural Sciences, Materials Science, Physics +17