Comparative performance of gold wire bonding on rigid and flexible substrates

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Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Yu Hin Chan, Jang‐Kyo Kim, Deming Liu et al. · IEEE Transactions on Advanced Packaging · 2005 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16

Process windows for low-temperature Au wire bonding

Yu Hin Chan, Jang‐Kyo Kim, Deming Liu et al. · Journal of Electronic Materials · 2004 · 14 citations

Natural Sciences, Materials Engineering, Materials Science +11