Publication | Closed Access
Influence of lattice self-heating and hot-carrier transport on device performance
22
Citations
11
References
1994
Year
EngineeringNew Device SimulatorThermal ConductivitySemiconductor DeviceSemiconductorsElectronic DevicesDc BehaviorNanoelectronicsTransport PhenomenaThermal ModelingThermodynamicsElectronic PackagingThermal ConductionDevice ModelingElectrical EngineeringLattice Self-heatingBias Temperature InstabilityThermal TransportDevice TechnologiesHeat TransferMicroelectronicsApplied PhysicsThermal EngineeringThermal Property
As device technologies improve, the traditional drift-diffusion transport model becomes inadequate to predict the performance of state-of-the-art semiconductor devices. The reasons are believed to be the larger field and field gradient inside advanced devices which cause lattice heating and hot carrier nonlocal transport phenomena. For more accurate prediction on device performance, a new device simulator capable of full thermodynamic simulation was developed. The carrier and carrier energy transport equations are directly derived from the Boltzmann transport equation, and the energy transfer among electrons, holes and crystal lattice takes into account most of the possible mechanisms. This simulator was used to simulate the DC behavior of a BJT and a half-micron NMOS. The simulation results show that for advanced devices, not only the drift-diffusion model becomes inadequate, but including only one of the two thermal effects results in error in simulated device characteristics.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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