Comparison of techniques for measuring both compressive and tensile stress in thin films

Squeeze-film damping in solid-state accelerometers

J. B. Starr · 1990 · 278 citations

Computing, Mechanical Engineering, Finite Element Analysis +13

A simple technique for the determination of mechanical strain in thin films with applications to polysilicon

H. Guckel, T. Randazzo, D.W. Burns · Journal of Applied Physics · 1985 · 270 citations

Natural Sciences, Materials Engineering, Materials Science +17

Microfabricated structures for the <i>i</i> <i>n</i> <i>s</i> <i>i</i> <i>t</i> <i>u</i> measurement of residual stress, Young’s modulus, and ultimate strain of thin films

Mark G. Allen, Mehran Mehregany, Roger T. Howe et al. · Applied Physics Letters · 1987 · 253 citations

Natural Sciences, Materials Engineering, Materials Science +17

Fine-grained polysilicon films with built-in tensile strain

H. Guckel, D.W. Burns, C.C.G. Visser et al. · IEEE Transactions on Electron Devices · 1988 · 158 citations

Natural Sciences, Materials Engineering, Materials Science +16

Effect of Deposition Conditions on Intrinsic Stress in a-Si: H Films

Kiyoshi Ozawa, Nobuyoshi Takagi, K. Asama · Japanese Journal of Applied Physics · 1983 · 32 citations

Natural Sciences, Materials Engineering, Materials Science +17