Characterization of Pd-free electroless Co-based cap selectively deposited on Cu surface via borane-based reducing agent - Concepedia

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Characterization of Pd-free electroless Co-based cap selectively deposited on Cu surface via borane-based reducing agent

19

Citations

12

References

2006

Year

S. Y. Chang, C.C. Wan, Y.Y. Wang, Chun-Hsing Shih, Ming-Hsien Tsai, S.L. Shue, Chenghui Yu, M.S. Liang

Thin Solid Films

Materials ScienceBorane-based Reducing AgentEngineeringSurface ElectrochemistrySurface ScienceElectrochemistryChemistryElectrochemical ProcessCu Surface

References

	Year	Citations

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