Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects - Concepedia

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Temperature-dependent stress-induced voiding in dual-damascene Cu interconnects

14

Citations

20

References

2008

Year

Zhenyu Wu, Yintang Yang, Changchun Chai, Yuejin Li, Jiayou Wang, Jing Liu, Bin Liu

Microelectronics Reliability

Materials ScienceElectromigration TechniqueEngineeringApplied PhysicsDefect FormationElectronic PackagingMicroelectronicsTemperature-dependent Stress-induced Voiding

References

	Year	Citations

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