Junction temperature analysis of IGBT devices

Abstract

The junction temperature of IGBT is the key factors that could influence the whole system's reliability and efficiency. An electro-thermal method was implemented to estimate the junction temperature of IGBT devices in this paper. The junction temperature of power devices was found out based on the power losses of IGBT devices and the transient thermal impedance model. The comparison between experiment using a 50 A/600 V IGBT module and calculation results shows that this method is effective.