Microstructure and Dielectric Properties of Composite Films for Embedded Capacitor Applications

Abstract

Embedded capacitors can effectively decrease the size of electronic appliances. This application prefers the use of dielectric films with a high dielectric constant prepared by low‐temperature processes. In the present paper, we report the preparation, characterization, and dielectric properties ranging from 10 kHz to 1 MHz of BaTiO 3 /epoxy and BaTiO 3 /Al composite films, processed at a low temperature. In the BaTiO 3 /resin composites, the ceramic content is limited and a maximum dielectric constant of 150 is obtained. A dense composite film of BaTiO 3 particles having varying grain sizes and prepared by aerosol deposition showed a maximum dielectric constant of 400. However, BaTiO 3 /aluminum composite showed a high dielectric constant of >30,000 due to the percolation effect.