Concepedia

Abstract

The major failure mode of power IGBT is the thermal fatigue of the solder joints. The thermal heating induces mechanical constraints due to the various coefficients of thermal expansion of different materials. The life in fatigue, bound to the non-elastic energy dissipated during a cycle, depends strongly on the non-linear behaviour. The reliability methods are then applied here with importance sampling durind an iterative process of reponse surface fitting.

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