Publication | Closed Access
Characterization of the mechanisms producing bending moments in polysilicon micro-cantilever beams by interferometric deflection measurements
28
Citations
5
References
2003
Year
Unknown Venue
EngineeringMicromechanicsMechanical EngineeringSilicon On InsulatorMicro-electromechanical SystemMechanicsExperimental MechanicInterferometric Deflection MeasurementsMaterials SciencePolysilicon Microstructure RigidityMechanical BehaviorSolid MechanicsMicrostructurePolysilicon Micro-cantilever BeamsMicrofabricationApplied PhysicsLinnik InterferometerStructural MechanicsMechanics Of Materials
Polysilicon micro-cantilever beams and doubly-supported beams are fabricated and conditioned with phosphorus doping and high-temperature anneal cycles to assess the effects of process history and geometry on polysilicon microstructure rigidity. Using a Linnik interferometer, deflection trends for series of beams are measured and compared for several process conditions. Two bending moments can induce beam deflection: the first due to the beam boundary support, and the second due to stress nonuniformity through the beam thickness. A comparison of polysilicon microstructure deflection behavior for doping and annealing conditions is presented and discussed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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