Joule heating effect in nonpolar and bipolar resistive random access memory

Abstract

The position of the conductive filament (CF) and the heating behaviour during a switching process in nonpolar and bipolar resistive random access memories (ReRAMs) were evaluated using thermal analysis. The position of the CF was clearly observed from Joule heating at the surface of the electrode on the CF. The position of the CF did not change during the switching cycle, except in the case of an unstable CF. In the nonpolar ReRAM, spike-shaped temperature increments were observed during both the forming and the set processes because of the overshoot current. However, the behaviour of the temperature increment in the bipolar ReRAM was virtually consistent with the profile of the electrical power.