Assembly and demonstration of high bandwidth-density optical MCM

Abstract

Optical interconnect technology with a higher bandwidth density is required as the performance of high-end computer systems increases. In the previous version of our developed organic optical multi-chip modules, the size of the fiber connectors limited the density. To obtain a higher bandwidth-density, we developed compact waveguide - fiber connectors which couple waveguides with fibers in a direction perpendicular to the module surface. An assembly method of the organic optical multi-chip module is established, and over 30 Gb/s operation for all channels of optical transmitters and receivers is demonstrated.