Direct liquid cooling For IGBT power module

Abstract

Power electronics systems trend to decrease size, increase switching frequency and voltage ratings. This has resulted in higher power dissipation dnesities of IGBT modules and higher junction temperature of IGBT devices. Thermal management becomes an important package design criteria. From the thermal resistance network of conventional indirect IGBT power module, the thermal interface material between IGBT power module and system cooler occupies a significant part. The present paper studies the thermal effects of IGBT power module with direct liquid cooling design. The microchannel cold plate is bonded with DBC substrate directly and elimitation thermal interface material. Thermal simulations of IGBT power with indirect liquid cooling and direct liquid cooling are complished and compared. The direct liquid cooling using microchannel cold plate can reduce thermal resistance and cooler size of IGBT power module effectively. Additionally, the microchannel cold plate can decrease the warpage and increase reliability of IGBT power module.